PART |
Description |
Maker |
570T190G21B 570E190LF15B 570S190LF21B 570T190LF09B |
EMI-RFII Crimp-Ring Micro-D Backshell Assembly EMI-RFII Crimp-Ring Micro-D Backshell Assembly
|
Glenair, Inc.
|
550E006M 550T006M 550S006M |
EMI/RFI D-Subminiature Split Backshell Crimp Ring Shield Termination
|
Glenair, Inc.
|
64001-1400 64001-1500 19073-0188 19073-0170 19204- |
Nylon Insulated Ring 3 and 4 Way Ring Splice and # 5-6, # 8, # 10, 1/4 Stud Size Ring Terminal with Universal Crimp Tool
|
MolexKits
|
EMIF06-MSD02C3 |
EMI Filtering And Signal Conditioning Mini and micro-SD card Mini and micro-SD card IPAD EMI filtering and ESD protection
|
ST Microelectronics STMicroelectronics
|
M85049-33-2-20N M85049-33-2-20W M85049-33-2-14N M8 |
Crimp Ring Backshell
|
Glenair, Inc.
|
507S177NC09B 507S177NC09E 507S177NC09EH 507S177NC0 |
EMI/RFI Micro-D Banding Backshell
|
Glenair, Inc. http://
|
EMIF06-1502M12 EMIF06-1502M1208 |
6-line IPAD?/a> low capacitance EMI filter and ESD protection in micro QFN package 6-line IPAD⑩ low capacitance EMI filter and ESD protection in micro QFN package
|
STMicroelectronics
|
73251-0160 |
50 Ohms, SMA Flange - 4 Hole - Jack Field Replaceable - EMI/RFI Ground Ring
|
Molex Electronics Ltd.
|
73251-0960 |
50 Ohms, SMA ll-Flange - Two Hole - Jack Field Replaceable -EMI/RFI Ground Ring
|
Molex Electronics Ltd.
|
73251-0880 |
50 Ohms, SMA ll-Flange - 4 Hole - Jack Field Replaceable -EMI/RFI Ground Ring
|
Molex Electronics Ltd.
|
507-178NF1505KFF 507-178NF1504KFF 507-178J1505KE 5 |
Micro-D Backshells EMI, Banding, Elliptical, Split
|
Glenair, Inc.
|
507-195M5102EE 507-195M5102EG 507-195M3102FE 507-1 |
EMI/RFI Micro-D Split Backshell Assembly
|
Glenair, Inc.
|